278 [Paper Accepted] IEEE JSSC admin 2023-06-09 2497
The following paper has been accepted for publication in the IEEE Journal of Solid-State Circuits

Author: Ji-Young Kim, Taeryeong Kim, Jeonghyeok You, Kiryong Kim, Byoung Mo Moon, Kyomin Sohn and Seong-Ook Jung
Title: An Energy-Efficient Design of TSV I/O for HBM with a Data Rate up to 10 Gb/s
Publiciation : IEEE Journal of Solid-State Circuits

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