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[Paper Accepted] Symp. VLSI |
admin |
2023-03-31 |
2482 |
The following paper has been accepted for publication in 2023 Symposia on VLSI Technology and Circuits
Author: Taeryeong Kim, Ji-Young Kim, Jeonghyeok You, Kiryong Kim, Byoung Mo Moon, Kyomin Sohn, and Seong-Ook Jung
Title: A Low-Voltage Area-Efficient TSV I/O for HBM with Data Rate up to 15Gb/s Featuring Overlapped Multiplexing Driver, ISI Compensators and QEC
Publiciation : 2023 Symposia on VLSI Technology and Circuits
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