253 [Paper Accepted] Symp. VLSI admin 2022-04-01 2316
The following paper has been accepted for publication in 2022 Symposia on VLSI Technology and Circuits

Author: Ji-Young Kim, Taeryeong Kim, Jeonghyeok You, Kiryong Kim, Byoung Mo Moon, Kyomin Sohn, and Seong-Ook Jung
Title: A Low Power TSV I/O with Data Rate up to 10 Gb/s for Next Generation HBM
Publiciation : 2022 Symposia on VLSI Technology and Circuits

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