 |
 |
 |
 |
 |
| 253 |
[Paper Accepted] Symp. VLSI |
admin |
2022-04-01 |
2477 |
The following paper has been accepted for publication in 2022 Symposia on VLSI Technology and Circuits
Author: Ji-Young Kim, Taeryeong Kim, Jeonghyeok You, Kiryong Kim, Byoung Mo Moon, Kyomin Sohn, and Seong-Ook Jung
Title: A Low Power TSV I/O with Data Rate up to 10 Gb/s for Next Generation HBM
Publiciation : 2022 Symposia on VLSI Technology and Circuits
Congratulations! |
|
